Buffer layer structures for stabilization of a lithium niobate device

ABSTRACT

An optical waveguide device including an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; and a silicon titanium oxynitride layer and a connecting layer for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an optical waveguide modulator, and more particularly, to the provision of improved thermal and temporal bias stability in optical waveguide devices.

2. Discussion of the Related Art

Mach Zehnder interferometers (MZI's) used as optical modulators are of great interest for high data rate fiber optical communications systems. A great deal of research has been carried out to develop this type of device since its introduction in the mid-70's. The practicality of Ti-diffused LiNbO₃ waveguide systems has allowed wide introduction of these devices in current optical communication systems.

FIG. 1 illustrates a plan view of a related art Z-cut lithium niobate Mach-Zehnder interferometer used for modulation of an optical signal. An optical waveguide path 4 is formed inside a surface of a lithium niobate (LiNbO₃) substrate 1 that splits into a first path 4 a and a second path 4 b and then recombines back into a single path 4′. The optical waveguide paths 4 a and 4 b may be formed by diffusion of a metal, for example titanium, or with other dopants that will form an optical path in the lithium niobate substrate 1. An electric field is applied to the first optical waveguide path 4 a and the second optical waveguide path 4 b via electrodes 2 a and 3, respectively, that are positioned over the first and second optical waveguide paths. Specifically, the electrode 2 a over the first optical waveguide path 4 a is a ground electrode and the electrode 3 over the second optical waveguide path 4 b is an input electrode. In addition, another ground electrode 2 b is positioned on the substrate so that ground electrodes 2 a and 2 b are on each side of the input electrode 3 for further control of the electric fields applied to the first and second optical waveguide paths 4 a and 4 b. The electrodes 2 a, 2 b and 3 are separated from the substrate 1 by a buffer layer 5. The application of the electric field changes the refractive index of an optical waveguide path in proportion to the amount of electric field applied. By controlling the amount of electric field applied via the electrodes 2 a, 2 b and 3, an optical signal passing through the optical waveguide paths can be modulated.

FIG. 2 is cross-sectional view of the related art Z-cut lithium niobate Mach-Zehnder interferometer along line B-B′ in FIG. 1. The buffer layer 5 is comprised of a transparent dielectric film and is positioned between the electro-optical crystal substrate 1 and the electrodes 2 a, 2 b and 3. The buffer layer 5 prevents optical absorption of the optical mode by the metal electrodes 2 a and 3. However, the buffer layer 5 allows electric fields that emanate from the electrode 3 to affect a refractive index change in either or both the first optical waveguide path 4 a or the second optical waveguide path 4 b. Typically, silicon dioxide (SiO₂) is used as the buffer layer due to its optical transparency at 1.55 microns and its low dielectric constant.

FIG. 2 also illustrates that electro-optical crystal substrate 1 of the related art Z-cut lithium niobate Mach-Zehnder interferometer is formed so that a Y axis of the crystal orientation extends in a longitudinal direction of the lithium niobate substrate 1 along the waveguide paths 4 a and 4 b. The Z axis of the crystal orientation extends in the direction of the thickness of the electro-optical crystal substrate 1 such that the top and bottom surfaces of the lithium niobate substrate 1 are respectively −Z and +Z faces in terms of the crystal lattice structure of the substrate. The optical waveguide paths are commonly denoted as being within the −Z face of the lithium niobate substrate.

One of the practical difficulties in the early introduction of Z-cut LiNbO₃ devices was the pyroelectric sensitivity of LiNbO₃, which resulted in the development of large internal fields within the devices when subjected to temperature changes or gradients across the device. This is because a change in temperature causes a change in the spontaneous polarization due to the ferroelectric properties of LiNbO₃. As illustrated in FIG. 2, this results in an imbalance of charge between the Z faces of the electro-optical crystal substrate 1, so that an electric field is generated in the Z direction perpendicularly along the waveguide paths 4 a and 4 b of the device. Due to the very high resistivity of LiNbO₃, these charges take a long time to travel through the electro-optical crystal substrate 1 and neutralize themselves. This imbalance of charge impedes or lessens the effect of the electrical fields from the electrodes 2 a, 2 b and 3 on the waveguide paths 4 a or 4 b, thus decreasing the effectiveness or control in modulating optical signals. Early modulators were highly susceptible to thermal changes and strict environmental controls were necessary for thermal stabilization of the devices.

An early approach to maintain or prevent loss of modulation control due to thermal effects was to bleed off or counteract the imbalance of charge between the Z faces of a LiNbO₃ substrate. C. H. Bulmer et al. (one of the authors is an inventor in this application), “Pyroelectric Effects in LiNbO₃ Channel Waveguide Devices,” Applied Physics Letters 48, p. 1036, 1986 disclosed that metallizing the Z faces, and electrically connecting them with a high conductivity path to allow the unbalanced charge to neutralize rapidly, resulted in improved thermal stability of an X-cut device. Nonetheless, in Z-cut devices, this approach is difficult since the waveguide paths are on the Z face, and a metalized layer on this face would short out the electrodes of the device, making the device ineffective or inoperable.

Instead of a metallization layer, P. Skeath et al. (one of the authors is an inventor in this application), “Novel Electrostatic Mechanism in the Thermal Stability of Z-Cut LiNbO₃ Interferometers,” Applied Physics Letters 49, p. 1221, 1986 and I. Sawaki et al., Conference on Lasers and Electro-Optics, MF2, PP. 46-47, San Francisco, 1986 suggested a semiconducting or semi-insulating layer on the Z face under the electrodes of a Z-cut device. The semiconducting or semi-insulating layer would transfer the unbalanced charge between the Z faces of the LiNbO₃ substrate but not short out the electrodes. Although X-cut devices are commonly treated by providing metal layers or other conductive layers on the Z faces and interconnecting the conductive layers, research continues as to what semiconductor or semi-insulating layer can be best or appropriately specified for use with Z-cut devices.

Approaches attempted in the past have included Indium Tin Oxide (ITO), Silicon (Si), and Silicon Titanium Nitride (Si_(x)Ti_(y)N_(z)) layers, which are applied in place of or above the usual SiO₂ buffer layer on a Z-cut optical waveguide device. Minford et al., “Apparatus and Method for Dissipating Charge from Lithium Niobate Devices, U.S. Pat. No. 5,949,944, Sep. 7, 1999, which is hereby incorporated by reference, proposes a silicon titanium nitride layer that has the advantage of adjustable resistivity by adjustment of the silicon/titanium ratio. However, control of the resistivity is unsatisfactory due to oxygen contamination in the silicon titanium nitride buffer layer, which results from residual background gases in the deposition system. This results in unacceptable run-to-run variation in the resistivity of a silicon titanium nitride buffer layer. Furthermore, the deposition system for a silicon titanium nitride buffer layer includes a sputtering process that requires a variety of targets with varying compositions to vary the composition of the buffer layer over a desired range and thus, is not a practical process with suitable control of the resistivity.

The effect of the electric field and the consistency of the effect of the electric field over time (i.e. temporal stability) applied to the waveguide paths are greatly affected by characteristics of the buffer layer. The amount of electric field from the electrodes that is affected by charge variations within the buffer layer or by the charge imbalance in the lithium niobate substrate is referred to as the bias drift of a device. Temporal stability of Z-cut Ti diffused LiNbO₃ devices has been discussed in Seino et al., “Optical Waveguide Device,” U.S. Pat. No. 5,404,412, Apr. 4, 1995, which is hereby incorporated by reference. Specifically, Seino et al. shows that repeated or constantly applied voltages across a buffer layer in a Z-cut device will ultimately result in a buffer layer developing charge screening processes that significantly reduces the electric field across the waveguide paths. Seino et al. further shows that by adding titanium and indium oxides to an SiO₂ buffer layer, the resulting bias drift was reduced (delayed in time).

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to LiNbO₃ devices that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.

One aspect of the invention relates to pyroelectric or thermal stabilization of LiNbO₃ electro-optical devices.

Another aspect of the invention relates to temporal stabilization of LiNbO₃ electro-optical devices.

Also, another aspect of the invention relates to a process enabling control of resistivity in a buffer layer structure for electro-optical devices.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:

FIG. 1 is a plan view of a related art Z-cut lithium niobate Mach-Zehnder interferometer;

FIG. 2 is cross-sectional view of the related art Z-cut lithium niobate Mach-Zehnder interferometer along line B-B′ in FIG. 1;

FIG. 3 is a chart of the resistivity vs. oxygen concentration for an exemplary buffer layer of the present invention;

FIG. 4 is a cross-sectional view of a Z-cut lithium niobate waveguide device according to a first exemplary embodiment of the present invention;

FIG. 5 is a chart of the thermal sensitivity for a Z-cut lithium niobate waveguide device according to the first exemplary embodiment of the present invention;

FIG. 6 is a cross-sectional view of a Z-cut lithium niobate waveguide device according to the second exemplary embodiment of the present invention;

FIG. 7 is a cross-sectional view of a Z-cut lithium niobate waveguide device according to a third exemplary embodiment of the present invention;

FIG. 8 is a cross-sectional view of a Z-cut lithium niobate waveguide device according to a fourth exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The preferred embodiments of the present invention relate to a silicon titanium oxynitride buffer layer structure formed by O₂ being deliberately introduced during a sputtering deposition process with a silicon nitride titanium nitride target in a nitrogen and a non-reactive gas environment. The O₂ concentration during the deposition of the silicon titanium oxynitride is a tuning parameter for adjusting the resistivity of a resulting buffer layer. In the alternative or in addition to adjusting the O₂ concentration, the N₂ concentration may be varied during deposition as another tuning parameter for adjusting the resistivity of the resulting buffer layer. Due to the ease in controlling the process, buffer layers over a broad range of resistivities can be produced from a single fixed ratio silicon nitride-titanium nitride target. Furthermore, a buffer layer having a resistivity gradient can be produced by controlling the amount of O₂ and/or N₂ during the deposition of the buffer layer.

In accordance with the present invention, a variety of exemplary silicon titanium oxynitride films were fabricated by sputtering from a 50% Si₃N₄-50% TiN target in an atmosphere containing a non-reactive sputtering gas (i.e., Ar), a predetermined amount of N₂, and a predetermined amount of O₂. Using the 50% Si₃N₄/50% TiN target and two chamber pressures of 1 and 5 m torr, gas flows of 40 sccm (standard cubic cm) Ar and 20 sccm N₂ were introduced into the reaction chamber for each film. The resistivity of each film was controlled by a flow rate of a 95% Ar/5% O₂ mixture that was between and 0.5-10 sccm for each film. Although exemplary conditions have been set forth above, the mixture of gases and flow rates may be varied or otherwise different for Si₃N₄/TiN targets having different percentages of compositions.

After deposition of the films, the resistivities were measured and the film oxygen content, in atomic percent, was measured using XPS analysis. The results are shown in the chart of FIG. 3, where resistivity vs. oxygen concentration is plotted. The film resistivities varied from approximately 10⁵ to 10¹⁰ Ohm-cm while oxygen concentrations in the films varied from approximately 5% to 65% (atomic %). The resistivities of the films were stable over periods of months, and were also stable when subjected to 125 degrees C. heat treatment in air overnight. Since O₂ and N₂ gas flow in the chamber was precisely controlled, and the O₂ chamber concentration was large compared to any residual background gases, run-to-run reproducibility of the resistivity was good.

In continued accordance with the present invention, the use of other percentage compositions for Si₃N₄ and TiN as the Si₃N₄—TiN target will further extend the range of resistivities that can be achieved by the process above. For example, a higher percentage of TiN (i.e., 40% Si₃N₄/60% TiN) in the target will allow for a range of lower resistivities that can be accurately obtained redundantly and a higher percentage of Si₃N₄ (i.e., 60% Si₃N₄/40% TiN) will allow for a range of higher resistivities that can be accurately obtained redundantly. For a predetermined fixed percentage composition Si₃N₄—TiN target, a predetermined resistivity, within the range of resistivities for that fixed percentage ratio target, can be accurately obtained redundantly by control of the O₂ concentration or N₂/O₂ ratio in the sputtering gas.

FIG. 4 is a cross-sectional view of a first exemplary embodiment of the present invention having a silicon titanium oxynitride film as a buffer layer for suppressing thermal (i.e., pyroelectric) effects in a broadband traveling wave Mach-Zehnder interferometer. The Mach-Zehnder interferometer includes a Z-cut lithium niobate substrate 10 in which optical waveguide paths 14 a and 14 b are formed by diffusion of a dopant, for example titanium, to form the optical waveguide paths. Electrodes 12 a and 13 are respectively positioned above (i.e. vertically separated from) or directly above (i.e. vertically separated from and overlapping) the first optical waveguide path 14 a and the second optical waveguide path 14 b. Specifically, the electrode 12 a over the first optical waveguide path 14 a is a ground electrode and the electrode 13 over the second optical waveguide path 14 b is an input electrode. In addition, another ground electrode 12 b is positioned on the substrate so that ground electrodes 12 a and 12 b are on each side of the input electrode 13 for further control of the electric fields applied to the first and second optical waveguide paths 14 a and 14 b. An undoped SiO₂ buffer layer 15 is formed on the surface of the Z-cut lithium niobate substrate 10 above the optical waveguide paths 14 a and 14 b. A silicon titanium oxynitride buffer layer 16 is positioned between the undoped SiO₂ buffer layer 15 and the electrodes 12 a, 12 b and 13, and above the optical waveguide paths 14 a and 14 b in the Z-cut lithium niobate substrate 10. The thickness of the silicon titanium oxynitride buffer layer 16 is about 0.1-1.0 micron and the thickness of the SiO₂ buffer layer 15 is about 0.1-1.5 micron. The undoped SiO₂ buffer 15 layer isolates the optical fields within the waveguide paths 14 a and 14 b from the metal electrodes with a low dielectric constant but yet has an optical transparency for an optical wavelength of 1.55 microns.

A connecting layer 17 interconnects the silicon titanium oxynitride buffer layer 16 above the −Z face (top surface) and the +Z face (bottom surface) of the lithium niobate substrate 10 on the sides (as shown in FIG. 4) or on one side of the lithium niobate substrate 10. A carbon or silver paint, solder paste, conductive epoxy or other conductive materials can be used as the connecting layer 17. Furthermore, resistive materials such as semiconductors or ceramics may be used as the connecting layer 17. In the alternative, the silicon titanium oxynitride buffer layer 16 and the +Z face (bottom surface) of the lithium niobate substrate 10 can both be commonly connected to the housing (not shown) of the device. Although the connecting layer 17 is shown in FIG. 4 as overlapping the top surface of the silicon titanium oxynitride 10, alternatively, the connecting layer 17 can just contact a side surface of silicon titanium oxynitride buffer layer 16.

Three devices of the first exemplary embodiment, as described above, were manufactured having different silicon titanium oxynitride buffer layer resistivities that varied from approximately 8.0×10⁴-2.5×10⁵ Ohm-cm. The resistivity of the SiO₂ buffer layer 15 under the silicon titanium oxynitride buffer layer 16 was approximately 2×10¹¹ Ohm-cm. The three devices were heated on a hot plate and the intrinsic interferometer phase change was monitored as the temperature of the device was increased from 25 to 45 degrees C. and then decreased from 45 to 25 degrees C. The intrinsic phase of an interferometer will change as the temperature changes due to thermal (i.e., pyroelectric) effects within the lithium niobate substrate to. The intrinsic phase of the interferometers due to thermal effects for the three devices with a silicon titanium oxynitride buffer layer and for a control device with just a SiO₂ buffer layer are shown in FIG. 5. The resistivity of the SiO₂ buffer layer on the control sample was approximately 2×10¹¹ Ohm-cm. Specifically, FIG. 5 shows the changes in intrinsic phase of the interferometers as the temperature is increased (from left to right) and then as the temperature is decreased (from right to left). The three devices with a silicon titanium oxynitride buffer layer show thermal sensitivities (change in interferometer phase/change in temperature) of approximately 2-2.5 degrees/degree C., nearly an order of magnitude smaller than the control sample without the silicon titanium oxynitride buffer layer. Therefore, the chart in FIG. 5 demonstrates that a silicon titanium oxynitride buffer layer achieves thermal stabilization and mitigates pyroelectric effects. In addition, the three devices did not exhibit any other performance degradation due to the presence of the silicon titanium oxynitride buffer layer.

A silicon titanium oxynitride buffer layer is useful for temporal as well as thermal stabilization of Z-cut LiNbO₃ devices. As discussed above with regard to FIG. 4, the SiO₂ buffer layer on a lithium niobate substrate isolates the optical field of the waveguide paths from the metal electrodes. Furthermore, SiO₂ has a refractive index of approximately 1.45 that is significantly less than the lithium niobate and thus prevents that optical signal from being absorbed by the electrodes. However, a silicon titanium oxynitride layer with an appropriate compositional structure can replace a SiO₂ buffer layer. Therefore, a buffer layer structure can be formed in a single layer in a single process.

For this application, the desired film properties for a single buffer layer structure of silicon titanium oxynitride are different than the SiO₂/silicon titanium oxynitride buffer layer structure described above with regard to FIG. 4 that was used only for thermal stabilization of an optical waveguide device. For both thermal and temporal stabilization, a silicon titanium oxynitride film should have a low N/O ratio at the interface between a buffer layer and lithium niobate substrate 10 to somewhat mimic the performance of a SiO₂ buffer layer, but yet have controlled degrees of resistivity throughout the layer. This can be achieved by appropriate control of the. N₂/O₂ ratio in the atmosphere of the sputtering deposition process when the silicon titanium oxynitride buffer layer is deposited on the lithium niobate substrate. Increasing the N₂/O₂ ratio during deposition causes a gradient in the N/O ration within the layer, and thus forms a graded silicon titanium oxynitride buffer layer. A lower N₂/O₂ ratio during the initial part of the deposition creates a lower N/O ratio within the graded silicon titanium oxynitride buffer layer adjacent to the interface between the buffer layer and lithium niobate substrate. The lower N/O ratio in the lower part of the buffer layer will serve to maintain optical confinement and improve temporal stabilization. A higher N₂/O₂ ratio during the latter part of the deposition creates a higher N/O ratio within the graded silicon titanium oxynitride buffer layer at the top surface of the buffer layer. The higher N/O ratio in the upper part of the buffer layer improves thermal stabilization.

FIG. 6 is a cross-sectional view of a second exemplary embodiment of the present invention having a silicon titanium oxynitride film as a single buffer layer for suppressing both thermal and temporal effects in a broadband traveling wave Mach-Zehnder interferometer. The Mach-Zehnder interferometer includes a Z-cut lithium niobate substrate 20 in which optical waveguide paths 24 a and 24 b are formed by diffusion of a dopant, for example titanium, to form the optical waveguide paths. Electrodes 22 a and 23 are respectively positioned above or directly above the optical waveguide paths. In addition, another electrode 22 b is positioned on the substrate so that electrodes 22 a and 22 b are on each side of the electrode 23, which is an input signal electrode. A graded silicon titanium oxynitride buffer layer 26 having gradients in the Si/Ti ratio and/or the N/O ratio is positioned on (i.e. in contact with) the Z-cut lithium niobate substrate below (i.e. vertically separated from) the electrodes 22 a, 22 b and 23, and above the optical waveguide paths 24 a and 24 b in the Z-cut lithium niobate substrate 20. The thickness of the graded silicon titanium oxynitride buffer layer 26 is about 0.1-1.5 micron. Similarly as previously discussed with regard to FIG. 4, a connecting layer 27 on the sides of the lithium niobate substrate 20 interconnects the graded silicon titanium oxynitride buffer layer 26 on the −Z face of the lithium niobate substrate 20 to the +Z face of the lithium niobate substrate 20.

The graded silicon titanium oxynitride buffer layer 26 may be doped with indium, or other rare earth metals, in metal or oxide form to further improve temporal stability. Preferably, the rare earth metals should at least be within the graded silicon titanium oxynitride buffer layer 26 adjacent the interface between the buffer layer and lithium niobate substrate 20. This can be accomplished by exposing another target (i.e., multi-source deposition) within the deposition chamber during the initial deposition of the graded silicon titanium oxynitride buffer layer 26.

By increasing the ratio of N₂ to O₂ during the sputtering deposition of the graded silicon titanium oxynitride buffer layer, the N/O ratio within the layer maintains optical confinement and improves both thermal and temporal stabilization of the device. However, the invention as described above with regard to FIG. 6 can also be applied as a two layer buffer structure instead of a single layer structure having a gradient. The two layer buffer structure further increases the range of resistivities available for each layer since a different percentage fixed target can be used for the deposition of each layer.

FIG. 7 is a cross-sectional view of the third exemplary embodiment of the present invention of two buffer layers of silicon titanium oxynitride for suppressing both thermal and temporal effects in a broadband traveling wave Mach-Zehnder interferometer. The Mach-Zehnder includes a Z-cut lithium niobate substrate 30 in which optical waveguide paths 34 a and 34 b are formed by diffusion with a dopant, for example titanium, to form the optical waveguide paths. Electrodes 32 a and 33 are respectively positioned above or directly above the optical waveguide paths. In addition, another electrode 32 b is positioned on the substrate so that electrodes 32 a and 32 b are on each side of the electrode 33, which is an input signal electrode. A first silicon titanium oxynitride buffer layer 36 having a first Si/Ti ratio and a first N/O ratio is positioned on the Z-cut lithium niobate substrate 30 below electrodes 32 a, 32 b and 33, and above the optical waveguide paths 34 a and 34 b. A second silicon titanium oxynitride buffer layer 37 having a second Si/Ti ratio and a second N/O ratio is positioned on the first silicon titanium oxynitride buffer layer below electrodes 32 a, 32 b and 33, and above the optical waveguide paths 34 a and 34 b. The thickness of the first silicon titanium oxynitride buffer layer 36 is about 0.1-1.5 micron and the thickness of the second titanium oxynitride buffer layer 37 is about 0.1-1.5 micron. Similarly as previously discussed with regard to FIG. 4, a connecting layer 38 on the sides of the lithium niobate substrate 30 interconnects the second silicon titanium oxynitride buffer layer to the +Z face (bottom surface) of the lithium niobate substrate 30.

The first Si/Ti ratio in the first silicon titanium oxynitride buffer layer 36 is larger than the second Si/Ti ratio in the second silicon titanium oxynitride buffer layer 37 for temporal stabilization of the Mach-Zehnder device. The second N/O ratio in the second silicon titanium oxynitride buffer layer 37 is larger than the first N/O ratio in the first silicon titanium oxynitride buffer layer 36 for thermal stabilization of the Mach-Zehnder device. Depending on the resistivities required, the first and second silicon titanium oxynitride buffer layers 36 and 37 are formed with different fixed percentage targets at different Si/Ti ratios. Alternatively, the first silicon titanium oxynitride buffer layer can be formed with a gradient change in the ratio of N/O like the graded silicon titanium oxynitride buffer layer discussed with regard to FIG. 6 but with less of a gradient change.

Another alternative is that the first silicon titanium oxynitride buffer layer 36 on the lithium niobate substrate in FIG. 7 may be doped with indium, or other rare earth metals, in metal or oxide form to further improve temporal stability. This can be accomplished by exposing another target (i.e., multi-source deposition including both a Si₃N₄—TiN target and a dopant target) within the deposition chamber during the deposition of the first silicon titanium oxynitride buffer layer 36. Another method would be to form the first silicon titanium oxynitride buffer layer 36 with a single Si₃N₄—TiN target containing the dopant for improving temporal stability.

FIG. 8 is a cross-sectional view of a fourth exemplary embodiment of the present invention having two buffer layers of silicon titanium oxynitride for suppressing both thermal and temporal effects in conjunction with a SiO₂ buffer layer that further prevents the optical signal from being absorbed by the electrodes in a Mach-Zehnder interferometer. The Mach-Zehnder interferometer includes a Z-cut lithium niobate substrate 40 in which optical waveguide paths 44 a and 44 b are diffused with a dopant, for example titanium, to form the optical waveguide paths. Electrodes 42 a and 43 are respectively positioned above or directly above the first optical waveguide paths 44 a and the second optical waveguide path 44 b. In addition, another electrode 42 b is positioned on the substrate so that electrodes 42 a and 42 b are on each side of the electrode 43, which is an input signal electrode. An undoped SiO₂ buffer layer 45 is formed on the surface of the Z-cut lithium niobate substrate 40 above the optical waveguide paths 44 a and 44 b. A first silicon titanium oxynitride buffer layer 46 having a first Si/Ti ratio and a first. N/O ratio is positioned on undoped SiO₂ buffer layer 45 below electrodes 42 a,42 b and 43, and above the optical waveguide paths 44 a and 44 b. A second silicon titanium oxynitride buffer layer 47 having a second Si/Ti ratio and a second N/O ratio is positioned on the first silicon titanium oxynitride buffer layer 46 below electrodes 42 a, 42 b and 43, and above the optical waveguide paths 44 a and 44 b. The thickness of the undoped SiO₂ buffer layer 45 is about 0.1-1.5 micron. The thickness of the first silicon titanium oxynitride buffer layer 46 is about 0.1-1.0 micron and the thickness of the second titanium oxynitride buffer layer 47 is about 0.1-1.0 micron. Similarly as previously discussed with regard to FIG. 4, a connecting layer 48 on the sides of the lithium niobate substrate 40 interconnects the second silicon titanium oxynitride buffer layer 47 to the +Z face (bottom surface) of the lithium niobate substrate 40.

The first Si/Ti ratio in the first silicon titanium oxynitride buffer layer 46 is larger than the second Si/Ti ratio in the second silicon titanium oxynitride buffer layer 47 for temporal stabilization of the Mach-Zehnder device. The second N/O ratio in the second silicon titanium oxynitride buffer layer 47 is larger than the first N/O ratio in the first silicon titanium oxynitride buffer layer 46 for thermal stabilization of the Mach-Zehnder device. Depending on the resistivities required, the first and second silicon titanium oxynitride buffer layers 46 and 47 are formed with different fixed percentage targets at different Si/Ti ratios. Alternatively, the first silicon titanium oxynitride buffer layer can be formed with a gradient change in the ratio of N/O like the graded silicon titanium oxynitride buffer layer discussed with regard to FIG. 6 but with less of a gradient change. As described with regard to FIGS. 6 and 7 above, the first silicon titanium oxynitride buffer layer 46 on the undoped SiO₂ buffer layer 45 may be doped with indium, or other rare earth metals, in metal or oxide form to further improve temporal stability.

Although the silicon titanium oxynitride films described above are in Z-cut optical devices, the films may also be used on any orientation of LiNbO₃. For example, a high Si/Ti ratio and low N/O ratio silicon titanium oxynitride may be used on the top surface of X-cut LiNbO₃ devices for temporal stabilization. Also the device illustrated in FIG. 2 may be formed such that an X axis of the crystal orientation extends in longitudinal direction of the lithium niobate substrate 1 along the waveguide paths 4 a and 4 b, with the Y axis replacing the X axis shown in the figure. In addition, the buffer structures described above can be used in other optical devices formed within LiNbO₃, LiTaO₃ or the like electro-optical materials, such as polarizers or optical switches, for thermal and/or temporal stabilization. Furthermore, other elements in column 4 (IVB) of the periodic table can be substituted for titanium in the disclosure above like, for example, Zirconium (Zr). For example, the first buffer layer in the device of FIG. 8 may be silicon zirconium oxynitride while the second buffer layer is silicon titanium nitride.

It will be apparent to those skilled in the art that various modifications and variations can be made in the optical waveguide device of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. 

1. An optical waveguide device comprising: an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; a silicon titanium oxynitride layer; and a connector for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.
 2. The optical waveguide device of claim 1, wherein an undoped silicon dioxide layer is positioned on the electro-optical crystal substrate for optical confinement of an optical signal within the optical waveguide path.
 3. The optical waveguide device of claim 2, wherein the silicon titanium oxynitride layer is configured to provide thermal stabilization; and an additional silicon titanium oxynitride layer for temporal stabilization is positioned between the silicon titanium oxynitride layer and the electro-optical crystal substrate.
 4. The optical waveguide device of claim 3, wherein a ratio of silicon to titanium in the additional silicon titanium oxynitride layer for temporal stabilization is greater than a ratio of silicon to titanium in the silicon titanium oxynitride layer for thermal stabilization.
 5. The optical waveguide device of claim 3, wherein the additional silicon titanium oxynitride layer for temporal stabilization is doped with indium.
 6. The optical waveguide device of claim 4, wherein the additional silicon titanium oxynitride layer for temporal stabilization is formed with a gradient change in the ratio of silicon to titanium.
 7. The optical waveguide device of claim 1, wherein an additional silicon titanium oxynitride layer for temporal stabilization is positioned between the silicon titanium oxynitride layer and the electro-optical crystal substrate; and the silicon titanium oxynitride layer is configured to provide thermal stabilization.
 8. The optical waveguide device of claim 7, wherein the additional silicon titanium oxynitride layer for temporal stabilization is doped with a rare earth metal.
 9. The optical waveguide device of claim 7, wherein a ratio of silicon to titanium in the additional silicon titanium oxynitride layer for temporal stabilization is greater than a ratio of silicon to titanium in the silicon titanium oxynitride layer for thermal stabilization.
 10. The optical waveguide device of claim 7, a ratio of silicon to titanium in the additional silicon titanium oxynitride layer for temporal stabilization is formed with a gradient change in the ratio of silicon to titanium.
 11. The optical waveguide device of claim 1, wherein the silicon titanium oxynitride layer is for thermal and temporal stabilization and positioned on the electro-optical crystal substrate; and a ratio of silicon to titanium in the silicon titanium oxynitride layer is formed with a gradient change in the ratio of silicon to titanium.
 12. The optical waveguide device of claim 11, wherein the silicon titanium oxynitride layer is doped with a rare earth metal.
 13. An optical waveguide device comprising: a Z-cut electro-optical crystal substrate having a top surface with a Z face and a bottom surface with a Z face; an optical waveguide path formed within the top surface of the electro-optical crystal substrate; a buffer layer structure, including a thermal stabilization buffer layer comprising silicon, an element in column 4 (IVB) of the periodic table, oxygen, and nitrogen, positioned above the optical waveguide path; at least one electrode positioned on the buffer layer structure for applying an electric field to the optical waveguide path; and a connecting layer on a side surface of the electro-optical crystal substrate for interconnecting the thermal stabilization buffer layer to the bottom surface of the electro-optical crystal substrate.
 14. The optical waveguide device of claim 13, wherein an undoped silicon dioxide layer is positioned on the top surface of the electro-optical crystal substrate for optical confinement of an optical signal within the optical waveguide path.
 15. The optical waveguide device of claim 14, wherein a temporal stabilization buffer layer comprising silicon, an element in column 4 (IVB) of the periodic table, oxygen, and nitrogen, is positioned between the thermal stabilization buffer layer and the electro-optical crystal substrate.
 16. The optical waveguide device of claim 15, wherein a ratio of nitrogen to oxygen in the temporal stabilization buffer layer is less than a ratio of nitrogen to oxygen in the thermal stabilization buffer layer.
 17. The optical waveguide device of claim 15, wherein the temporal stabilization buffer layer is doped with a rare earth metal.
 18. The optical waveguide device of claim 16, wherein the temporal stabilization buffer layer is formed with a gradient change in the ratio of nitrogen to oxygen.
 19. The optical waveguide device of claim 13, wherein a temporal stabilization buffer layer is positioned between the thermal stabilization buffer and the top surface of the electro-optical crystal substrate.
 20. The optical waveguide device of claim 19, wherein the temporal stabilization buffer layer is doped with a rare earth metal.
 21. The optical waveguide device of claim 19, wherein a ratio of nitrogen to oxygen in the temporal stabilization buffer layer is less than a ratio of nitrogen to oxygen in the thermal stabilization buffer layer.
 22. The optical waveguide device of claim 21, wherein the temporal stabilization buffer layer is formed with a gradient change in the ratio of nitrogen to oxygen.
 23. The optical waveguide device of claim 13, wherein the thermal stabilization buffer layer is also configured to provide for temporal stabilization and positioned on the electro-optical crystal substrate; and a ratio of nitrogen to oxygen in the buffer layer is formed with a gradient change in the ratio of nitrogen to oxygen.
 24. The optical waveguide device of claim 23, wherein the buffer layer is doped with a rare earth metal.
 25. The optical waveguide device of claim 13, wherein the connecting layer comprises one of conductive paint, solder, semiconductor, ceramic and conductive epoxy.
 26. A method for forming an optical waveguide device comprising the steps of: forming an optical waveguide path within a surface of the electro-optical crystal substrate; forming a buffer layer comprising silicon, an element in column 4 (IVB) of the periodic table, oxygen, and nitrogen, positioned above the optical waveguide path; forming at least one electrode positioned above the buffer layer for applying an electric field to the optical waveguide path; forming a connecting means for interconnecting the thermal stabilization buffer layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.
 27. The method for forming an optical waveguide device of claim 26, wherein the buffer layer is sputter deposited using a target comprised of silicon nitride and a nitride of an element in column 4 (IVB) of the periodic table.
 28. The method for forming an optical waveguide device of claim 27, wherein the buffer layer is sputter deposited in atmosphere containing O₂ and N₂.
 29. The method for forming an optical waveguide device of claim 27, wherein the target further comprises a rare earth metal.
 30. The method for forming an optical waveguide device of claim 27, wherein an additional target containing a rare earth metal is exposed while the buffer layer is sputter deposited. 